没有永远的敌人：Intel和AMD宣布合作打造第八代酷睿?处理器，Kaby Lake/Coffee Lake-H + RX Vega M 独显

本文地址：http://www.moepc.net/?post=3501

2018/05/01：AMDGPU Linux内核驱动提供了Vega M的支持

可以看到…..许多很interesting的地方…. 侧面证实Vega M实际上就是Polaris 22。

比如下面这一条“bypass GPU info firmware load for VEGAM”

会绕过对VEGAM内置的GPU信息固件的读取。

因为之前AIDA64读取出来是“Polaris 22”，gg

此外VEGAM的GMC、SDMA用的也都是gfx800系列一个版本的驱动。【GMC8.0，SDMA3.0，gfx800系列都是这个】

2018/04/07：RX Vega M实际上采用的可能是Polaris架构改版。

早在去年6月份，本站报道过它的代号为“Palo Alto P22” ，实际上 = Polaris 22，此前显示的gfx804也是正确的，

去年报道它的时候，我这里在发布之前收到的所有消息都显示P22是Polaris架构（还打过?能网的脸），到最终发布却叫“Vega M”，当时以为我收到的所有信息都是错误的（显然不大可能，几个消息源都这么说。），也很怀疑是不是AMD搞错了什么。

既然正式发布都说它是Vega，本站也只能改叫Vega。

Polaris 22的基础架构应该还是Polaris（GCN4），只是针对Intel的要求有定制，比如RX Vega M GH上的64ROP，AMD从没有给24CU的小核心配过64ROP这么多（一般AMD中端都是32ROP）；再加上HBM2的IMC，可以猜测Polaris 22的内部可能有Vega架构的部分功能（换HBM2不是加个IMC这么简单的），但总体上还是更接近Polaris而不是Vega。Vega M只支持DX12_0，而RR和Vega10都支持DX12_1。

RX Vega M GH/GL也只能算SKU的名字，正式的核心代号依然是“Polaris 22”，这一点AMD一直没有公布。

这样一来Vega M和Vega Mobile就是两个东西了。

Vega M = P22，实际SKU：RX Vega M GH/GL

Vega Mobile = Vega架构移动版集显（15FF, 15DD），实际SKU：Vega 28 Mobile、Vega 11 Mobile，此外CES上发布的那块独立GPU也叫“Vega Mobile”….

该举措和AMD的Vega Everywhere策略可能有关？

图源：PCWORLD

=====18/01/08=====

Intel正式发布了Kaby Lake-G，原本想着要不要弄个新帖，后来想想已经发了这么多新闻，东西也和预测的一模一样，就”简单”介绍一下新的信息好了。

Intel 8代命名规则，H就是接下来Coffee Lake-H会用的后缀，代表高性能，同时也指Hexa -6核。【之前传HQ的有没有用膝盖想过…】

-G就是今天介绍的Kaby Lake-G

-U则包括Kaby Lake-R U和……拭目以待。

Intel发布了5款Kaby Lake-G SKU：

i7-8809G/8709G板载RX Vega M GH独显，100W TDP

8809G的CPU/GPU/HBM2不锁频

i7-8706G/8705G，i5-8305G板载RX Vega M GL独显，65W TDP

修正：8305G也是4C/8T

8706G带vPRO。

详尽规格已经整理到下表。

CPU还是那个CPU，Kaby Lake-H 四核，七代标压用的那块，45W TDP，可配置到35W。

CPU和GPU之间为传统的PCIe，只有8条3.0，剩下8条3.0给其他用途（TB3等），4条给芯片组，分出更多PCIe和I/O。

有两款GPU，都搭配4GB HBM2显存，HBM2和GPU之间采用Intel的EMIB连接，得以达成1.7mm的超薄z-height。显存带宽差距大概10%，并不多

RX Vega M GH性能更高，1536SP(24CU）的规格，频率也是更高的1063/1190MHz，4SE（4个几何引擎，64ROP)，各项性能吞吐量更强，官方数据是比GTX 1060 MaxQ 强 7-13%。

RX Vega M GL虽然有1280SP(20CU)，频率也低一些931/1011MHz，但只有2SE（2个几何引擎，32ROP），相当于1个SE里10个CU，某些情况下可能会遇到前端瓶颈，官方给出的性能也只比GTX 1050高10-40%。

同时Intel称在KBL-G上用到了Dynamic Tuning Technology，更好地管理CPU/GPU的电源分配。

Intel的数字：62.5W SDP的设计，在开启Dynamic Tuning后相当于45W的设计，提升了能耗比。

Intel给出的测试数据

拿8809G+Vega M GH 和3年前的老系统 – 4720HQ+960M 对比

8809G+Vega M GH 和7700HQ + GTX1060 MaxQ 对比

也有定位稍低产品的对比

8705G + Vega M GL和3年前的老系统 4720HQ + GTX950M的对比

8705G + Vega M GL和 i7-8550U + GTX1050的对比

Intel也发布了配套的驱动软件，和产品名称一样，驱动软件里也被抹去了所有AMD的图标和字眼，只有Radeon，颜色也换为蓝色。

至于实际产品，PPT里写了Dell，HP和NUC

Dell：已经发现了XPS 15 9575将搭载Kaby Lake-G的低端型号。

HP：Spectre 15

代号为Hades Canyon VR/Hades Canyon的NUC也已经发布，8809G版本的NUC售价999美元，8705G版本售价799美元。

性能、规格都很美好，体积也控制的不错

就是这价格….可能不太友好

==============早前的消息2018/01/02===========

i7-8809G的信息出现在了Intel网站上

证实了此前的很多预测。

i7-8809G被分类进可超频版，符合原来的-K后缀，推测不锁倍频

大约两年前，Intel开始了内部代号为“Palo Alto P22”的项目

今年开始有Kaby Lake-G的传闻

六月Sisoft数据库首次泄露

Intel用AMD集显？ – 只是MCM，代号”Palo Alto”
http://www.moepc.net/?post=2154

此后的NUC路线图

Intel新NUC路线图：”Hades Canyon VR”, KabyLake四核+独显
http://www.moepc.net/?post=3061

Intel在11月正式宣布这款和AMD合作的产品，详情见本文。

“Palo Alto P22”，产品代号Kaby Lake-G，实际上属于第7代Kaby Lake，路线图中显示为第X代，现被冠以8代的名号

采用Kaby Lake-H四核+ Radeon RX Vega M独显（dGFX）

4C/8T，双通道DDR4 2400+，100W/66W “Target” Package TDP

66W版本NUC代号Hades Canyon，GPU只有1280SP，原为i7-XXXX系列【锁倍频】

100W版本NUC代号Hades Canyon VR，GPU为1536SP，原为i7-XXXXK系列【不锁倍频】

此前还出现了6C/12T的Coffee Lake-H + AMD GPU，其他信息未知【总之不会再叫Kaby Lake-G了..】

100W的i7-8809G被分类进可超频版，符合原来的-K后缀，推测不锁倍频

===================早前的消息2017/11/09========================

Intel和AMD宣布合作打造第八代酷睿处理器，采用Intel x86 CPU+ AMD Radeon 显卡，以及HBM2，采用Intel的EMIB将多个芯片封装在同一个处理器内，供新一代高性能轻薄游戏笔记本/NUC搭载。

11.09更新KabyLake-G/Hades Canyon的实体芯片图

与个人预计的一样，性能将在GTX 1050Ti和1060之间

供电说明TDP不低，规格上是100W。

新的产品将会归于第八代酷睿家族，将高性能Core-H处理器【KBL-H】和HBM2，以及AMD RTG为Intel定制的第三方独显芯片通过EMIB封装在一个处理器内。相当于Intel从AMD手里买来独显通过胶水EMIB和HBM2黏在一起，再在旁边粘上Intel CPU。CPU依然是原来的CPU，GPU依然是独立的GPU。

Intel和AMD RTG的队伍合作，一同设计了一个全新的半定制显示芯片，并配备HBM2，通过EMIB实现极短距离上的高带宽传输，而省去了interposer增加的高度及其他成本。根据视频信息推断EMIB只在HBM2和GPU之间使用，CPU和GPU之间应该还是传统的PCIe。

此外没见过?能网报道出过多次偏差负过泽的。你们“媒体”都是这样，出了事了比香港记者逃得还快。

“我们与Intel的合作能够拓展AMD Radeon GPU的用户(提高市占率)，并将高性能图形的一种与众不同的解决方案带向市场。” AMD RTG VP & GM，Scott Herkelman称。“我们共同向游戏玩家和内容创作者提供能在3A大作和内容创作程序中，具备独显级别性能的更轻更薄的PC。新的半定制GPU把Radeon显卡带给了对视觉性能没有妥协的新一类发烧友。”

设计的核心是Intel的EMIB技术。同时它也是首个采用HBM2显存的移动PC处理器。HBM2结合EMIB，极大地节省了空间的占用，有助于达成更小更轻薄的设计。

Intel和AMD自从上世纪八十年代就是竞争对手，但这次Intel选择了AMD而不是NVIDIA。此次合作并不是把显示技术授权给Intel。

一名AMD发言人称，Intel的新芯片打造的笔记本不会与自家的Ryzen Mobile直接竞争。【CPU性能相差不大，但显示性能还是有差距的】

他说Intel的这款芯片主要是为高要求玩家打造，而Ryzen Mobile只需要能够流畅运行游戏，而不是专为游戏打造。

“我们正处于一个互相取长补短的市场中，” 该发言人说到。

本文地址：http://www.moepc.net/?post=3501

目前曝光的型号有i7-8809G、i7-8706G、i7-8705G

性能方面虽然有分数但并不可靠，在GTX 1050Ti和1060之间

都是各方面的泄露数据，一切以最终发布规格为准，泄露的平台规格和最终规格会不一样

更新新的测试信息：出现了6C/12T版本，Coffee Lake-H + RX Vega M GPU，应该是最终版本。

“Palo Alto P22” – 应该归属于7代的KBL-G/Hades Canyon并没有这一款，显然现在不能称之为KBL-G了，推测Intel调整了计划，增加了新产品。关于原路线图的信息可以在文章下面的链接里找到。【P22=Polaris 22，说明本人之前的猜想没有错误，只是AMD把SKU命名为了Vega M…本质上是Polaris 22 + Vega的部分IP模块 + HBM2 IMC, 架构还是gfx804.】

AMD桌面平台首发GPU规格

参考阅读：

Intel新NUC路线图：”Hades Canyon VR”, KabyLake四核+独显
http://www.moepc.net/?post=3061

Intel用AMD集显？ – 只是MCM，代号”Palo Alto”
http://www.moepc.net/?post=2154

新闻原文：

New Intel Core Processor Combines High-Performance CPU with Custom Discrete Graphics from AMD to Enable Sleeker, Thinner Devices

New Intel Design and Packaging Innovations Reduce Silicon Footprint by More Than 50%, Enable Real Time Power Sharing Across CPU and GPU for Optimal Performance

By Christopher Walker

We often talk about our focus on driving innovation for the enthusiast community, a targeted but growing segment of the PC market. This point is underscored by what we have been delivering with our Intel® Core? X-series processors, Intel® Core? H-series mobile processors and, more recently, the first of our 8th Gen Intel® Core? desktop processors. Each product line offers a range of new capabilities, workloads and form factors to cater to the diverse needs of enthusiasts.

But as we looked at this lineup, we recognized an opportunity: thinner, lighter, more powerful enthusiast mobile platforms that deliver a premium experience. Currently, most enthusiast mobile PCs have Intel Core H-series processors plus higher-powered discrete graphics1, resulting in systems that average 26 mm in height. Compare this to thin and light laptops that are trending down to 16 mm or less, with some even as thin as 11 mm.

We wanted to find a way to improve this. A way to deliver a stronger combination of performance-level processors and discrete graphics that open the door to even smaller form factors.  And, we knew we could do it by combining our Embedded Multi-Die Interconnect Bridge (EMIB) technology with a new power-sharing framework.

Today, we’re sharing initial details on a new product that does exactly that, reducing the usual silicon footprint to less than half that of standard discrete components on a motherboard. That’s more freedom for OEMs to be creative and deliver innovative thin and light designs with improved thermal dissipation. It also delivers space to add new features, create new board layouts, explore new cooling solutions or increase battery life.

The new product, which will be part of our 8th Gen Intel Core family, brings together our high-performing Intel Core H-series processor, second generation High Bandwidth Memory (HBM2) and a custom-to-Intel third-party discrete graphics chip from AMD’s Radeon Technologies Group* ? all in a single processor package.

It’s a prime example of hardware and software innovations intersecting to create something amazing that fills a unique market gap. Helping to deliver on our vision for this new class of product, we worked with the team at AMD’s Radeon Technologies Group. In close collaboration, we designed a new semi-custom graphics chip, which means this is also a great example of how we can compete and work together, ultimately delivering innovation that is good for consumers.

“Our collaboration with Intel expands the installed base for AMD Radeon GPUs and brings to market a differentiated solution for high-performance graphics,” said Scott Herkelman, vice president and general manager, AMD Radeon Technologies Group. “Together we are offering gamers and content creators the opportunity to have a thinner-and-lighter PC capable of delivering discrete performance-tier graphics experiences in AAA games and content creation applications. This new semi-custom GPU puts the performance and capabilities of Radeon graphics into the hands of an expanded set of enthusiasts who want the best visual experience possible.”

At the heart of this new design is EMIB, a small intelligent bridge that allows heterogeneous silicon to quickly pass information in extremely close proximity. EMIB eliminates height impact as well as manufacturing and design complexities, enabling faster, more powerful and more efficient products in smaller sizes. This is the first consumer product that takes advantage of EMIB.

Similarly, the power sharing framework is a new connection tailor-made by Intel among the processor, discrete graphics chip and dedicated graphics memory. We’ve added unique software drivers and interfaces to this semi-custom discrete GPU that coordinate information among all three elements of the platform. Not only does it help manage temperature, power delivery and performance state in real time, it also enables system designers to adjust the ratio of power sharing between the processor and graphics based on workloads and usages, like performance gaming. Balancing power between our high-performing processor and the graphics subsystem is critical to achieve great performance across both processors as systems get thinner.

Intel introduces a new product in the 8th Gen Intel Core processor family that combines a high-performance CPU with discrete graphics and HBM2 for a thin, sleek design. A comparison shows the space these components take on a traditional board (left) and on the new 8th Gen Intel Core processor that combines the components all on one package. (Credit: Intel Corporation)

Additionally, this solution is the first mobile PC to use HBM2, which consumes much less power and takes up less space compared to traditional discrete graphics-based designs using dedicated graphics memory, like GDDR5 memory.

This new addition to the 8th Gen Intel Core processor family builds on our strong portfolio of mobile and graphics solutions. Our 8th Gen and 7th Gen Intel Core processors brought capabilities like brilliant 4K content creation and consumption in amazing new designs. And as the leading supplier of PC Graphics, media and display technologies2, we deliver the visual experience to the majority of computers with our Intel HD and UHD graphics. Now, we’re opening the door for thinner, lighter devices across notebooks, 2 in 1s and mini desktops, while delivering incredible performance and graphics for enthusiasts.

Some might say the PC market is mature and has been for some time. At Intel, we challenge that notion every day. We are always creating new possibilities people haven’t seen or experienced. Look for more to come in the first quarter of 2018, including systems from major OEMs based on this exciting new technology.

Chris Walker is vice president of the Client Computing Group and general manager of the Mobile Client Platform at Intel Corporation.

本文地址：http://www.moepc.net/?post=3501

via：https://www.wsj.com/articles/rivals-intel-and-amd-team-up-on-pc-chips-to-battle-nvidia-1509966064

https://newsroom.intel.com/editorials/new-intel-core-processor-combine-high-performance-cpu-discrete-graphics-sleek-thin-devices/

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