在JP Morgan会议上Lisa Su也透露了接下来7nm制程的大致计划。
原话：
Harlan Sur – JPMorgan
We talked initially in our discussion about the momentum carrying forward for the team and I think one of the things that you guys did a good job at Analyst Day was helping us to understand what’s next, right? And a good example of that is if we look at Zen 2, which you discussed at Analyst Day, that’s going to be ready sort of 2018, 2019 timeframe. Just maybe discuss in a little bit more granularity about the potential launch dates. These products are proposed to be using 7-nanometer technology from your foundry partners. When do you think such products are going to be sort of ready for tape-out and when do we see these products sort of out in the market?
Lisa Su
“Yes, so our goal is to be very competitive in terms of our long-term roadmap. If you look at the foundry 7-nanometer roadmap compared to some of the other technologies out there, it’s actually really competitive. And I think the gap between sort of the foundry roadmap and like the Intel roadmap has gotten a lot closer. Our goal is to be aggressive with 7-nanometer technology. We will be doing tape-outs later this year. And as we get closer to production, we’ll give more insights there. But the idea is to be very competitive throughout the product portfolio.”
AMD将会在7nm上采取激进的策略，今年晚些时候首批流片（Tape-out）
这说明Zen2及Navi的设计会在今年底前完成
Zen2和Navi能否成功很大程度上将取决于女朋友是否给力，首先是会否跳票，然后是性能。【7nm节点AMD会同时使用TSMC和GF】
从流片到上市时间相隔大概8-12个月（Vega去年8月流片，Zen是去年2月流片，今年3月最终上市）
女朋友之前公布的计划是2018H2初风险试产7nm（DUV），2018H2开始HVM（high-volume manufacturing），Zen2和Navi流片后半年以上。
传闻的Intel 10nm新架构Icelake会在2019。
当然，GF你懂得，之前多少次被坑得不轻不要过于乐观，总体目标应该是今年内流片。
GF/Samsung工艺性能预计
TSMC工艺性能预计
TSMC 7FF
TSMC 22nmULP/12nmFFC/12nmFFC+
英文transcript：OC3D
表格：Anandtech
本站编译，转载请注明出处。
