没有永远的敌人:Intel和AMD宣布合作打造第八代酷睿​处理器,Kaby Lake-H + Polaris 独显
首页 > 观测 > 数码科技    作者:剧毒术士马文   2017年11月9日 22:40 星期四   热度:3021°   56条评论    
时间:2017-11-9 22:40   热度:3021° 

本文地址:http://www.moepc.net/?post=3501

Intel和AMD宣布合作打造第八代酷睿处理器,采用Intel x86 CPU+ AMD Radeon 显卡,以及HBM2,采用Intel的EMIB将多个芯片封装在同一个处理器内,供新一代高性能轻薄游戏笔记本/NUC搭载。


11.09更新KabyLake-G/Hades Canyon的实体芯片图

DOLwFP4X4AUuLSd_guetzli.jpg

GKUwsC6_guetzli.jpg

与个人预计的一样,性能将在GTX 1050Ti和1060之间,最接近的应该是R9 285/380

供电说明TDP不低,规格上是100W。


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新的产品将会归于第八代酷睿家族,将高性能Core-H处理器【KBL-H】和HBM2,以及AMD RTG为Intel定制的第三方独显芯片通过EMIB封装在一个处理器内。相当于Intel从AMD手里买来独显通过胶水EMIB和HBM2黏在一起,再在旁边粘上Intel CPU。CPU依然是原来的CPU,GPU依然是独立的GPU。


Intel和AMD RTG的队伍合作,一同设计了一个全新的半定制显示芯片,并配备HBM2,通过EMIB实现极短距离上的高带宽传输,而省去了interposer增加的高度及其他成本。根据视频信息推断EMIB只在HBM2和GPU之间使用,CPU和GPU之间应该还是传统的PCIe。


【根据目前看到的信息,该独显Polaris架构,1536SP,频率1GHz左右,配备4GB HBM2显存,详细规格见下图。之前所谓“Vega”架构的谣言早就被reddit证伪,测试显示的信息就是gfx804,属于Polaris架构。尽管Polaris不是为HBM2而设计,具体是如何配置的还得等进一步消息。采用Polaris架构意味着AMD自家产品能保持1代架构优势。】


此外没见过〇能网报道出过多次偏差负过泽的。你们“媒体”都是这样,出了事了比香港记者逃得还快。


“我们与Intel的合作能够拓展AMD Radeon GPU的用户(提高市占率),并将高性能图形的一种与众不同的解决方案带向市场。” AMD RTG VP & GM,Scott Herkelman称。“我们共同向游戏玩家和内容创作者提供能在3A大作和内容创作程序中,具备独显级别性能的更轻更薄的PC。新的半定制GPU把Radeon显卡带给了对视觉性能没有妥协的新一类发烧友。”


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设计的核心是Intel的EMIB技术。同时它也是首个采用HBM2显存的移动PC处理器。HBM2结合EMIB,极大地节省了空间的占用,有助于达成更小更轻薄的设计。


Intel和AMD自从上世纪八十年代就是竞争对手,但这次Intel选择了AMD而不是NVIDIA。此次合作并不是把显示技术授权给Intel。


一名AMD发言人称,Intel的新芯片打造的笔记本不会与自家的Ryzen Mobile直接竞争。【CPU性能相差不大,但显示性能还是有差距的】

他说Intel的这款芯片主要是为高要求玩家打造,而Ryzen Mobile只需要能够流畅运行游戏,而不是专为游戏打造。


“我们正处于一个互相取长补短的市场中,” 该发言人说到。


本文地址:http://www.moepc.net/?post=3501



目前曝光的型号有i7-8809G、i7-8706G、i7-8705G

性能方面虽然有分数但并不可靠,泄露分数的低端大致性能在GTX950级别,高端为R9 380级别

都是各方面的泄露数据,一切以最终发布规格为准。


QQ截图20171107163144.png



AMD桌面平台首发GPU规格

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参考阅读:

Intel新NUC路线图:"Hades Canyon VR", KabyLake四核+独显
http://www.moepc.net/?post=3061


Intel用AMD集显? - 只是MCM,代号"Palo Alto"
http://www.moepc.net/?post=2154


新闻原文:

New Intel Core Processor Combines High-Performance CPU with Custom Discrete Graphics from AMD to Enable Sleeker, Thinner Devices


New Intel Design and Packaging Innovations Reduce Silicon Footprint by More Than 50%, Enable Real Time Power Sharing Across CPU and GPU for Optimal Performance

By Christopher Walker

We often talk about our focus on driving innovation for the enthusiast community, a targeted but growing segment of the PC market. This point is underscored by what we have been delivering with our Intel® Core™ X-series processors, Intel® Core™ H-series mobile processors and, more recently, the first of our 8th Gen Intel® Core™ desktop processors. Each product line offers a range of new capabilities, workloads and form factors to cater to the diverse needs of enthusiasts.

But as we looked at this lineup, we recognized an opportunity: thinner, lighter, more powerful enthusiast mobile platforms that deliver a premium experience. Currently, most enthusiast mobile PCs have Intel Core H-series processors plus higher-powered discrete graphics1, resulting in systems that average 26 mm in height. Compare this to thin and light laptops that are trending down to 16 mm or less, with some even as thin as 11 mm.

We wanted to find a way to improve this. A way to deliver a stronger combination of performance-level processors and discrete graphics that open the door to even smaller form factors.  And, we knew we could do it by combining our Embedded Multi-Die Interconnect Bridge (EMIB) technology with a new power-sharing framework.

Today, we’re sharing initial details on a new product that does exactly that, reducing the usual silicon footprint to less than half that of standard discrete components on a motherboard. That’s more freedom for OEMs to be creative and deliver innovative thin and light designs with improved thermal dissipation. It also delivers space to add new features, create new board layouts, explore new cooling solutions or increase battery life.

The new product, which will be part of our 8th Gen Intel Core family, brings together our high-performing Intel Core H-series processor, second generation High Bandwidth Memory (HBM2) and a custom-to-Intel third-party discrete graphics chip from AMD’s Radeon Technologies Group* – all in a single processor package.

It’s a prime example of hardware and software innovations intersecting to create something amazing that fills a unique market gap. Helping to deliver on our vision for this new class of product, we worked with the team at AMD’s Radeon Technologies Group. In close collaboration, we designed a new semi-custom graphics chip, which means this is also a great example of how we can compete and work together, ultimately delivering innovation that is good for consumers.

“Our collaboration with Intel expands the installed base for AMD Radeon GPUs and brings to market a differentiated solution for high-performance graphics,” said Scott Herkelman, vice president and general manager, AMD Radeon Technologies Group. “Together we are offering gamers and content creators the opportunity to have a thinner-and-lighter PC capable of delivering discrete performance-tier graphics experiences in AAA games and content creation applications. This new semi-custom GPU puts the performance and capabilities of Radeon graphics into the hands of an expanded set of enthusiasts who want the best visual experience possible.”

At the heart of this new design is EMIB, a small intelligent bridge that allows heterogeneous silicon to quickly pass information in extremely close proximity. EMIB eliminates height impact as well as manufacturing and design complexities, enabling faster, more powerful and more efficient products in smaller sizes. This is the first consumer product that takes advantage of EMIB.

Similarly, the power sharing framework is a new connection tailor-made by Intel among the processor, discrete graphics chip and dedicated graphics memory. We’ve added unique software drivers and interfaces to this semi-custom discrete GPU that coordinate information among all three elements of the platform. Not only does it help manage temperature, power delivery and performance state in real time, it also enables system designers to adjust the ratio of power sharing between the processor and graphics based on workloads and usages, like performance gaming. Balancing power between our high-performing processor and the graphics subsystem is critical to achieve great performance across both processors as systems get thinner.


Intel introduces a new product in the 8th Gen Intel Core processor family that combines a high-performance CPU with discrete graphics and HBM2 for a thin, sleek design. A comparison shows the space these components take on a traditional board (left) and on the new 8th Gen Intel Core processor that combines the components all on one package. (Credit: Intel Corporation)


Additionally, this solution is the first mobile PC to use HBM2, which consumes much less power and takes up less space compared to traditional discrete graphics-based designs using dedicated graphics memory, like GDDR5 memory.

This new addition to the 8th Gen Intel Core processor family builds on our strong portfolio of mobile and graphics solutions. Our 8th Gen and 7th Gen Intel Core processors brought capabilities like brilliant 4K content creation and consumption in amazing new designs. And as the leading supplier of PC Graphics, media and display technologies2, we deliver the visual experience to the majority of computers with our Intel HD and UHD graphics. Now, we’re opening the door for thinner, lighter devices across notebooks, 2 in 1s and mini desktops, while delivering incredible performance and graphics for enthusiasts.

Some might say the PC market is mature and has been for some time. At Intel, we challenge that notion every day. We are always creating new possibilities people haven’t seen or experienced. Look for more to come in the first quarter of 2018, including systems from major OEMs based on this exciting new technology.

Chris Walker is vice president of the Client Computing Group and general manager of the Mobile Client Platform at Intel Corporation.


本文地址:http://www.moepc.net/?post=3501

via:https://www.wsj.com/articles/rivals-intel-and-amd-team-up-on-pc-chips-to-battle-nvidia-1509966064

https://newsroom.intel.com/editorials/new-intel-core-processor-combine-high-performance-cpu-discrete-graphics-sleek-thin-devices/

beyond3Dforum

https://forum.beyond3d.com/posts/2009849/

bitsandchips@twitter

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本文作者:剧毒术士马文      文章标题: 没有永远的敌人:Intel和AMD宣布合作打造第八代酷睿​处理器,Kaby Lake-H + Polaris 独显
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香霖堂杂工Google Chrome 62.0.3202.75Windows 72017-11-07 11:22
感觉老黄又被搞了啊,不过pc领域不论是游戏还是专业的显示卡老黄还是有绝对优势的
剧毒术士马文2017-11-07 16:06
@香霖堂杂工:老黄一直靠着自己市场份额在搞AMD你怎么不说
AMD需要扩大市场份额和影响力。
香霖堂杂工Google Chrome 62.0.3202.89Windows 72017-11-08 12:56
@剧毒术士马文:老黄这两年春风得意着呢,是应该收敛一下了,这是好事
janzizakGoogle Chrome 50.0.2661.102Windows 102017-11-07 10:32
i家图形部门是该打入冷宫了
剧毒术士马文2017-11-07 16:05
@janzizak:不冲突,可以并存的东西。
定位都不一样
易内道德Google Chrome 62.0.3202.75Windows 102017-11-07 10:17
竟然是北极星嘛 传说中vega inside的版本呢
感觉这个东西是不是苹果专用啊 其他厂家应该不会花大力气搞这个吧
昆布Internet Explorer 11.0Windows 72017-11-07 12:24
@易内道德:Vega么留着给先给Ryzen用呀,先上Polaris探探路
剧毒术士马文2017-11-07 16:04
@易内道德:Vega inside早就证明是谣传,国内媒体只看到一张图并没有看到被证伪。
只是Intel内部叫Mr.Vega的人。
LV3的萝莉控Google Chrome 57.0.2987.132Linux2017-11-07 09:13
这样看来RYZEN也许要放弃高性能移动平台了?
LuluEhhGoogle Chrome 59.0.3071.30Windows 102017-11-07 11:03
@LV3的萝莉控:不是放弃,是本来就上不去
剧毒术士马文2017-11-07 16:03
@LV3的萝莉控:不冲突
JonSun30Safari 604.3.5Mac OSX 10_13_12017-11-07 09:03
目测新的Mac mini会基于这个平台打造。不知道15寸的MacBook pro会不会采用这套方案。不过看这个指标13寸MacBook pro是没戏了,好希望13寸的能上apu啊T T
剧毒术士马文2017-11-07 16:03
@JonSun30:苹果用的可能性不小
amdfanFirefox 56.0Android2017-11-07 07:30
ati千秋万载,一统江湖。
atkghostGoogle Chrome 61.0.3163.79Windows 72017-11-07 02:35
也就是说,AMD跟INTEL达成协议,把移动平台中高端市场让给INTEL,同时拉动显卡业务。
康猩猩SouGou Browser 2.XWindows 102017-11-07 02:32
GPU是用INTEL的工艺还是GF的?如果是INTEL的话,就可以看看INTEL和GF的工艺差距了。
剧毒术士马文2017-11-07 02:53
@康猩猩:99%可能是GF。
EMIB就是为了集成不同工艺IP
而且用的是Polaris,设计上就是14LPP工艺,和intel的差距不是14/16nm差距那么小的。
chnhiGoogle Chrome 60.0.3112.113Windows 102017-11-07 01:29
对于笔记本 跟 nuc之类的来说确实能省下一片空间。。。
是奔着 15寸 2kg以内 的超薄高性能游戏本或者难道说是冲着VR一体机去的嘛。
剧毒术士马文2017-11-07 02:28
@chnhi:是这样的,节省了不少体积
性能方面还要等具体数据,泄露的不一定准确

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